Plymouth, MA.... Tech-Etch uses cost-saving photoetching to manufacture Board Level Shielding components such as custom fences with removable covers. The photoetching process improves design flexibility, shortens lead times, and eliminates hard tooling costs. Prototypes are available in five days. In addition, photoetching allows the fabrication of Board Level Shielding components with close tolerances that duplicate stamping without the high tool cost. Fences, covers and mounting pins can be designed in any configuration, as can through holes, slots and internal dividers. Depth-etch bend lines facilitate hand forming, and soldered or resistance welded seams are available. Board level shielding is typically etched from .007" - .020" brass, nickel silver, copper or cold rolled steel. Board level shielding can also be manufactured out of beryllium copper, if spring qualities are desired. Other materials, thicknesses and finishes are also available.
A global leader in shielding technology, Tech-Etch, Inc. manufactures a complete line of standard and custom shielding products for both the commercial and military markets.
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